Published January 28, 2026 | Version v1
Dataset Open

Nano-scale mechanistic model for reactive hybrid solder joints - original data

Description

This data set was created in the frame of FWF project P34894 - Hybrid solder joins, new promising soldering strategy, Grant DOI 10.55776/P34894

This file contains the original reseach data presented in the manuscript "Nano-scale mechanistic model for microstructural reliability in reactive hybrid solder joints" doi:10.1016/j.matchar.2024.114247 and were used to generate charts the figures of this research.
Data created by / Authors: Farzad Khodabakhshi, Irina Wodak, Andriy Yakymovych, Shabnam Taheriniya, Saba Khademorezaian, Gerhard Wilde, Golta Khatibi,
The materials are provided to ensure transparency, reproducibility, and ease of re‑analysis.

Contents:
TiFF, JPG, PNG images of High‑resolution microscopy or imaging data used as the basis for figures and charts. files/ Images are named according to sample identifiers to allow straightforward matching between raw data and figure components. Date of generation is included in respective images.
Source files (XLSX) used to generate quantitative graphs and statistical visualizations.
Supplementary and additional datasets that support the figures.

Notes: 
Main Folder names correspond to figure numbers, subfolder/ file names correspond to sample IDs where applicable.
Data are provided in their original formats unless otherwise specified in the manuscript.
imaging data are provided in their original formats without post‑processing.
The experimentals details concenring the images are included in the manuscript.
Figures as published in the manuscript are included as pdf as additional information.

For reading dm3 /dm4 file pls see: 
https://github.com/ovidiopr/DM3Viewer
or
https://www.mathworks.com/matlabcentral/fileexchange/43005-read-dm3-and-dm4-image-files

Files

Files (120.7 MiB)

Additional details

Related works

Is part of
Journal Article: https://doi.org/10.1016/j.matchar.2024.114247 (URL)

Funding

FWF Austrian Science Fund
Hybrid solder joins, new promising soldering strategy P34894

Dates

Available
2024-08-08